The primary purpose of IPC-9704 is to enable manufacturers to perform objective analysis of the strain and strain rate levels that surface mount components may be subjected to during assembly, testing, and operation. The IPC-9704 standard's key goal is to help manufacturers identify problematic assembly and test processes before they lead to failures, enabling proactive fixes to processes, fixtures, or designs.
During manufacturing, assembly, and testing, PCBs undergo various physical stresses. Without proper strain testing, these stresses lead to hidden defects that cause field failures.
Maintain a distance of 1.0 mm to 2.0 mm from the component edge to clear the solder fillet and adhesive overflow.
The standard helps engineers identify high-stress steps in the production cycle. By measuring surface strain, manufacturing facilities can minimize the risk of solder joint cracking, pad cratering, and component damage. Why Strain Gage Testing Matters